ข้อมูลสัญลักษณ์จำแนกการออกแบบผลิตภัณฑ์ระหว่างประเทศ


รหัส / code คำอธิบาย / code name Version
H01L0021760000 Making of isolation regions between components 1
H01L0021761000 PN junctions 1
H01L0021762000 Dielectric regions 1
H01L0021763000 Polycrystalline semiconductor regions 1
H01L0021764000 Air gaps 1
H01L0021765000 by field-effect 1
H01L0021768000 Applying interconnections to be used for carrying current between separate components within a device 1
H01L0021770000 Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate 1
H01L0021780000 with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L0021304000) 1
H01L0021782000 to produce devices, each consisting of a single circuit element (H01L0021820000 takes precedence);; 1
H01L0021784000 the substrate being a semiconductor body 1
H01L0021786000 the substrate being other than a semiconductor body, e.g. insulating body 1
H01L0021820000 to produce devices, e.g. integrated circuits, each consisting of a plurality of components 1
H01L0021822000 the substrate being a semiconductor, using silicon technology (H01L0021825800 takes precedence);; 1
H01L0021822200 Bipolar technology 1