ดาวน์โหลด

ข้อมูลสัญลักษณ์จำแนกการออกแบบผลิตภัณฑ์ระหว่างประเทศ

รหัส / code คำอธิบาย / code name Version
H01L0021825200 the substrate being a semiconductor, using III-V technology (H01L0021825800 takes precedence);; 1
H01L0021825400 the substrate being a semiconductor, using II-VI technology (H01L0021825800 takes precedence);; 1
H01L0021825600 the substrate being a semiconductor, using technologies not covered by one of groups H01L0021822000, H01L0021825200; or H01L0021825400; (H01L0021825800 takes precedence);; 1
H01L0021825800 the substrate being a semiconductor, using a combination of technologies covered by ; H01L0021822000, H01L0021825200, H01L0021825400; or H01L0021825600 1
H01L0021840000 the substrate being other than a semiconductor body, e.g. being an insulating body 1
H01L0021860000 the insulating body being sapphire, e.g. silicon on sapphire structure, i.e. SOS 1
H01L0021980000 Assembly of devices consisting of solid state components formed in or on a common substrate; Assembly of integrated circuit devices (H01L0021500000 takes precedence);; 1
H01L0023000000 Details of semiconductor or other solid state devices (H01L0025000000 takes precedence);; 1
H01L0023020000 Containers; Seals (H01L0023120000, H01L0023340000, H01L0023480000, H01L0023552000 take precedence);; 1
H01L0023040000 characterised by the shape 1
H01L0023043000 the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body 1
H01L0023045000 the other leads having an insulating passage through the base 1
H01L0023047000 the other leads being parallel to the base 1
H01L0023049000 the other leads being perpendicular to the base 1
H01L0023051000 another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type 1
จำนวนรหัสข้อมูล 15 จาก 73902