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ข้อมูลสัญลักษณ์จำแนกการออกแบบผลิตภัณฑ์ระหว่างประเทศ

รหัส / code คำอธิบาย / code name Version
H01L0021600000 Attaching leads or other conductive members, to be used for carrying current to or from the device in operation 1
H01L0021603000 involving the application of pressure, e.g. thermo-compression bonding (H01L0021607000 takes precedence);; 1
H01L0021607000 involving the application of mechanical vibrations, e.g. ultrasonic vibrations 1
H01L0021620000 the devices having no potential-jump barriers or surface barriers 1
H01L0021640000 Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not specially adapted for a single type of device provided for in groups ; H01L0031000000-H01L0051000000 1
H01L0021660000 Testing or measuring during manufacture or treatment 1
H01L0021670000 Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components 1
H01L0021673000 using specially adapted carriers 1
H01L0021677000 for conveying, e.g. between different work stations 1
H01L0021680000 for positioning, orientation or alignment 1
H01L0021683000 for supporting or gripping (for positioning, orientation or alignment H01L0021680000) 1
H01L0021687000 using mechanical means, e.g. chucks, clamps or pinches 1
H01L0021700000 Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof (manufacture of assemblies consisting of preformed electrical components H05K0003000000, H05K0013000000) 1
H01L0021710000 Manufacture of specific parts of devices defined in group H01L0021700000; (H01L0021280000, H01L0021440000, H01L0021480000 take precedence);; 1
H01L0021740000 Making of buried regions of high impurity concentration, e.g. buried collector layers, internal connections 1
จำนวนรหัสข้อมูล 15 จาก 73902