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ข้อมูลสัญลักษณ์จำแนกการออกแบบผลิตภัณฑ์ระหว่างประเทศ

รหัส / code คำอธิบาย / code name Version
H01L0021469000 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques (encapsulating layers H01L0021560000); After-treatment of these layers 1
H01L0021470000 Organic layers, e.g. photoresist (H01L0021475000, H01L0021475700 take precedence);; 1
H01L0021471000 Inorganic layers (H01L0021475000, H01L0021475700 take precedence);; 1
H01L0021473000 composed of oxides or glassy oxides or oxide-based glass 1
H01L0021475000 using masks 1
H01L0021475700 After-treatment 1
H01L0021476300 Deposition of non-insulating-, e.g. conductive-, resistive-, layers on insulating layers; After-treatment of these layers (manufacture of electrodes H01L0021280000) 1
H01L0021477000 Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering (H01L0021360000-H01L0021449000, H01L0021461000-H01L0021475000; take precedence);; 1
H01L0021479000 Application of electric currents or fields, e.g. for electroforming (H01L0021360000-H01L0021449000, H01L0021461000-H01L0021477000; take precedence);; 1
H01L0021480000 Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups ; H01L0021060000-H01L0021326000 1
H01L0021500000 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups ; H01L0021060000-H01L0021326000 1
H01L0021520000 Mounting semiconductor bodies in containers 1
H01L0021540000 Providing fillings in containers, e.g. gas fillings 1
H01L0021560000 Encapsulations, e.g. encapsulating layers, coatings 1
H01L0021580000 Mounting semiconductor devices on supports 1
จำนวนรหัสข้อมูล 15 จาก 73902